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NUP4304MR6,
SZNUP4304MR6
Low Capacitance Diode
Array for ESD Protection in
Four Data Lines
NUP4304MR6 is a micro ? integrated device designed to provide
protection for sensitive components from possible harmful electrical
transients; for example, ESD (electrostatic discharge).
Features
? Low Capacitance (1.5 pF Maximum Between I/O Lines)
? Single Package Integration Design
? Provides ESD Protection for JEDEC Standards JESD22
Machine Model = Class C
Human Body Model = Class 3B
http://onsemi.com
TSOP ? 6
CASE 318F
PIN CONFIGURATION
AND SCHEMATIC
?
?
?
?
Protection for IEC61000 ? 4 ? 2 (Level 4)
8.0 kV (Contact)
15 kV (Air)
Ensures Data Line Speed and Integrity
Fewer Components and Less Board Space
Direct the Transient to Either Positive Side or to the Ground
I/O 1
V P 2
1/O 3
6 I/O
5 V N
4 I/O
Applications
MARKING DIAGRAM
?
USB 1.1 and 2.0 Data Line Protection
?
?
?
?
?
?
?
?
?
T1/E1 Secondary IC Protection
T3/E3 Secondary IC Protection
HDSL, IDSL Secondary IC Protection
Video Line Protection
Microcontroller Input Protection
Base Stations
I 2 C Bus Protection
AEC ? Q101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
LG M G
G
LG = Specific Device Code
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping ?
?
This is a Pb ? Free Device*
NUP4304MR6T1G
TSOP ? 6
3,000 /
(Pb ? Free)
Tape & Reel
SZNUP4304MR6T1G
TSOP ? 6
(Pb ? Free)
3,000 /
Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
? Semiconductor Components Industries, LLC, 2012
January, 2012 ? Rev. 4
1
Publication Order Number:
NUP4304MR6/D
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